System and method for measuring the temperature of a device
US7826998B1 · kind B1 · utility
3Cited by
17References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2005 |
| Grant date | Nov 2, 2010 |
| Priority date | — |
| Expiry date | Nov 15, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K7/01
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of measuring the temperature of device under test includes the steps of injecting a first current into an on-chip diode wherein a die containing the on-chip diode is under test. A second current is injected into the on-chip diode. A junction temperature is calculated based on the first current and the second current.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.