Protocol method apparatus and system for the interconnection of electronic systems
US7827334B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2008 |
| Grant date | Nov 2, 2010 |
| Priority date | — |
| Expiry date | Oct 8, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F13/385
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Disclosed are methods, apparatus, and systems for the interconnection of electronic system apparatus having one or more different communication protocols. A preferred embodiment is disclosed in which a single physical interface and a single protocol are used for providing an efficient and scalable interconnection between a host and operably coupled subsystem apparatus connected to the MMC. In a disclosed method, a bus is provided for coupling a system host to a plurality of system components and a Multi-Management Protocol (MMP) is employed. The Multi-Management Protocol includes a plurality of subclasses, each further including component identity information and function data. The subclasses are grouped by functionality into at least two groups comprising a standard group and an extension group. In a multi-component electronic system according to the invention, an electronic protocol packet structure includes a starting frame delimiter, a length field, a target address field, a subclass identifier, an operation identifier, a data field, and a frame check field. Disclosed preferred embodiments also include protocol conversion apparatus having a Multi-Management Controller (MMC) usi…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.