Electroplating process of electroplating an elecrically conductive sustrate
US7827680B2 · kind B2 · utility
5Cited by
37References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2004 |
| Grant date | Nov 9, 2010 |
| Priority date | — |
| Expiry date | Sep 10, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplating process of electroplating an electrically conductive substrate is described. The process includes electroplating intermittently to a predetermined plating thickness using the substrate surface as a cathode and a plating metal as an anode at a constant voltage between the anode and the cathode by repeating application of a voltage between a cathode and an anode and interruption of the application alternately. It is described that a voltage time/interruption time ratio is 0.1 to 1.0, a voltage time is not longer than 10 seconds, and an interruption time is not less than 1 x 10-12 seconds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.