Thermocouple circuit and method and system for forming same

US7828480B2 · kind B2 · utility

Assignee

• CORNING INCORPORATED · US

Inventors

• Lee Martin Adelsberg · Elmira, US
• John Michael Drosdak · Big Flats, US
• Paul Richard Grzesik · Corning, US
• Trudy A Knutson · Frankfort, US
• David Myron Lineman · Corning, US
• Kevin Barry Reiman · Horseheads, US

Key dates

• Filing date: Dec 20, 2007
• Grant date: Nov 9, 2010
• Expiry date: Dec 14, 2028

Classification

• Technology area (CPC G): Physics
• CPC primary: G01K7/04
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Disclosed is a thermocouple circuit that exhibits reduced levels of thermocouple drift. The thermocouple is generally comprised of first and second thermoelectric elements formed of first and second thermoelectric materials, respectively. The first and second thermoelectric elements are coupled to an electrically conductive substrate through intermediate first and second tab elements, respectively. The first and second tab elements are preferably formed of the respective first and second thermoelectric materials, and coupled to the substrate in a spaced apart configuration such that the first and second tab elements, are not physically coupled one to the other. Also disclosed are systems and methods for the preparation and use of the thermocouple circuits disclosed herein.