Interconnected-multi-element-lattice polishing pad
US7828634B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2007 |
| Grant date | Nov 9, 2010 |
| Priority date | — |
| Expiry date | Sep 8, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y80/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The polishing pad (104) is useful for polishing at least one of magnetic, optical and semiconductor substrates (112) in the presence of a polishing medium (120). The polishing pad (104) includes a plurality of polishing elements (402, 502, 602, 702). The polishing elements (402, 502, 602, 702) are aligned in a vertical direction and having a first and a second end. A plurality of junctions (404, 510, 610, 710) connects the first and second ends of the polishing elements (402, 502, 602, 702) with at least three polishing elements at each of the plurality of junctions (404, 510, 610, 710) for forming a tier. Each tier representing a thickness in the vertical direction between the first and second ends of the polishing elements (402, 502, 602, 702). And an interconnected lattice structure (400, 600) forms from connecting sequential tiers of the plurality of junctions (404, 504) that connect the polishing elements (402, 502, 602, 702).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.