Imprint method, imprint apparatus, and process for producing chip
US7828984B2 · kind B2 · utility
7Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2006 |
| Grant date | Nov 9, 2010 |
| Priority date | — |
| Expiry date | Sep 9, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB82Y40/00
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
An imprint method for imprinting an imprint pattern of a mold onto a pattern formation material on a substrate so as to realize a high throughput includes the steps of bringing the imprint pattern and the pattern formation material into contact with each other; applying a first pressure between the mold and the substrate to increase a contact area between the imprint pattern and the pattern formation material; and adjusting a positional relationship between the mold and the substrate at a second pressure lower than the first pressure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.