Solder pillar bumping and a method of making the same

US7829380B2 · kind B2 · utility

Assignee

• Qimonda AG · DE

Inventors

• Roland Irsigler · Munich, DE
• Harry Hedler · Germering, DE

Key dates

• Filing date: Oct 31, 2006
• Grant date: Nov 9, 2010
• Expiry date: Mar 12, 2028

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/14
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method of forming flip chip bumps includes forming a plurality of metallization pads on a die. In another step, a structured layer having pores is formed on the die and metallization pads where the pads on the die are exposed through the pores. In yet another step, the die is transferred to a chamber having a liquid metal bath. In another step, a first pressure is created within the chamber followed by dipping the die in the liquid metal bath. In another step, a second pressure is created within the chamber such that liquid metal fills portions of the pores thereby forming metal pillars connected to the pads.