Low dielectric glass and fiber glass for electronic applications
US7829490B2 · kind B2 · utility
15Cited by
3References
40Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2006 |
| Grant date | Nov 9, 2010 |
| Priority date | — |
| Expiry date | Mar 4, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0366
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Glass compositions are provided that are useful in electronic applications, e.g., as reinforcements in printed circuit board substrates. Reduced dielectric constants are provided relative to E-glass, and fiber forming properties are provided that are more commercially practical than D-glass.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.