Sealing system and method for sealing a component within an electronic device
US7829786B2 · kind B2 · utility
17Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2007 |
| Grant date | Nov 9, 2010 |
| Priority date | — |
| Expiry date | Apr 4, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S277/921
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A sealing system for sealing a component (102) within an electronic device (100) is provided. The system includes one or more apertures (206) within an internal housing (202). Further the system includes an adhesive (602), adhered on a first surface to a ledge (502) and bottom perimeter surface 402 of the component. Furthermore, the system includes an external housing (204). The external housing presses the perimeter of the component onto the ledge.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.