Solder wire construction
US7829791B2 · kind B2 · utility
0Cited by
10References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2008 |
| Grant date | Nov 9, 2010 |
| Priority date | — |
| Expiry date | Mar 24, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solder construction carrier device for connecting electrical components including a carrier with a plurality of compartments and a solder construction disposed in each of the plurality of compartments. Each solder construction includes a conductive wire and a solder component disposed adjacent to the conductive wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.