Memory module thermal management
US7830690B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2006 |
| Grant date | Nov 9, 2010 |
| Priority date | — |
| Expiry date | May 8, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05D23/19
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A method is disclosed for implementing a scheme to configure thermal management control for a memory device resident on a memory module for a computing platform. A method is also disclosed for implementing the configured thermal management control. In a run-time environment for a computing platform a temperature is obtained from a thermal sensor monitoring the memory module. The memory module is in a given memory module with thermal sensor configuration that includes the memory device. An approximation of a temperature for the memory device is made based on thermal information associated with the given configuration of the memory module and the obtained temperature. The configured thermal management control for the memory device is implemented based on the approximated temperature. Other implementations and examples are also described in this disclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.