Patent · US Active

Method for soldering with a multistep temperature profile

US7832620B2 · kind B2 · utility

2Cited by

11References

17Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Ingo Berger · Taufkirchen, DE
Jan Münzer · Berlin, DE
Ingo Reinkensmeier · Fritzlar, DE
Silke Settegast · Berlin, DE

Key dates

Filing date	Jun 17, 2009
Grant date	Nov 16, 2010
Priority date	—
Expiry date	Jun 17, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02T50/60
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

In soldering processes according to prior art, there is often an insufficient tie-up to a substrate of a component. A method in which no voids occur during the soldering processes is provided. A temperature pattern is proposed according to the method in which the temperature is lowered successively during the soldering operation.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.