Material reducing apparatus
US7832670B2 · kind B2 · utility
14Cited by
23References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2007 |
| Grant date | Nov 16, 2010 |
| Priority date | — |
| Expiry date | Apr 12, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB02C2013/28663
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Described herein is a material reducing apparatus including a bypass arm and a bypass control member for allowing reduction-resistant objects of a material to bypass the apparatus while avoiding interruption of the operation of the apparatus. Other embodiments may be described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.