Apparatus for treating thin film and method of treating thin film
US7833350B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2005 |
| Grant date | Nov 16, 2010 |
| Priority date | — |
| Expiry date | Nov 10, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32135
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for treating a substrate includes a stage adapted to receive the substrate; a gas shield facing the substrate and having a retention space, the gas shield including: a top plate; a bottom plate facing the substrate and having pump holes around the retention space; and a middle plate between the top and bottom plates and having a first gas path communicating with the retention space and a second gas path communicating with the pump holes; an energy source facing the top plate such that light emitted therefrom irradiates a part of the substrate through the retention space; a reaction gas supplier connected to the first gas path; and a pressure adjusting device connected to the second gas path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.