Features in substrates and methods of forming
US7833426B2 · kind B2 · utility
2Cited by
19References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 11, 2007 |
| Grant date | Nov 16, 2010 |
| Priority date | — |
| Expiry date | Mar 5, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The described embodiments relate to features in substrates and methods of forming same. One exemplary embodiment can be a microdevice that includes a substrate extending between a first substrate surface and a generally opposing second substrate surface, and at least one feature formed into the first surface along a bore axis that is not transverse to the first surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.