System and method for removing an organic film from a selected portion of an implantable medical device using an infrared laser
US7833463B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2006 |
| Grant date | Nov 16, 2010 |
| Priority date | — |
| Expiry date | Aug 13, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1158
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
In one embodiment, a method of removing an organic film from a selected portion of an implantable medical device includes: selecting a portion of an implantable medical device from which to remove an organic film comprising a silane primer and a polymer of para-xylylene; using a laser set at a first value for an operational parameter, tracing the perimeter of the selected portion to ablate the organic film along the perimeter; using an infrared laser set at a second value for the operational parameter, scanning the selected portion of the device to heat the surface of the device within the perimeter of the selected portion and thereby separate the organic film from the surface of the device within the perimeter of the selected portion; and mechanically removing the chemically separated organic film from the surface of the device within the perimeter to expose the selected portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.