Process for manufacturing micromechanical devices containing a getter material and devices so manufactured
US7833880B2 · kind B2 · utility
10Cited by
15References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 28, 2006 |
| Grant date | Nov 16, 2010 |
| Priority date | — |
| Expiry date | Apr 21, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C1/00285
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A process is provided for manufacturing micromechanical devices formed by joining two parts together by direct bonding. One of the parts (12) is made of silicon and the other one is made of a material chosen between silicon and a semiconductor ceramic or oxidic material. The joint between the two parts forms a cavity (14) containing the functional elements of the device (11), possible auxiliary elements and a getter material deposit (13).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.