Printed circuit board manufacturing method and printed circuit board
US7834277B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2007 |
| Grant date | Nov 16, 2010 |
| Priority date | — |
| Expiry date | Apr 8, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method of manufacturing printed a circuit board capable of formation of via holes having a low aspect ratio and formation of fine lines, and a printed circuit board manufactured by the method. The method of manufacturing a printed circuit board 10 according to the present invention includes a step of selectively forming a plating layer 16 for lands 22a and 22b on a metal foil 14 on the printed circuit board 10, a step of adjusting the thickness of the plating layer 16, and a step of forming the metal foil 14 into lines 14a. The aspect ratio of via holes 28 formed on lands 22a and 22b can be adjusted by adjusting the thickness of the lands 22a and 22b.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.