Method and apparatus for laser processing
US7834293B2 · kind B2 · utility
11Cited by
11References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 2, 2006 |
| Grant date | Nov 16, 2010 |
| Priority date | — |
| Expiry date | Oct 18, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0097
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and an apparatus for processing workpieces with a laser beam include first and second stages for holding the workpieces and first and second laser beam paths. The first workpiece is loaded upon the first stage, aligned with the first laser beam path, and processing begun. While the first workpiece is aligned in relation to the first laser beam path, the second workpiece is prepared in relation to the second laser beam path. Processing of the second workpiece is begun as soon as the laser beam is available for processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.