Thin film pattern forming device and method
US7834332B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2006 |
| Grant date | Nov 16, 2010 |
| Priority date | — |
| Expiry date | Aug 11, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/858
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thin film pattern forming device includes a chamber case having an inner space communicated with the outside, a first fixing unit provided in the chamber case, a pattern electrode plate having a certain shape and fixed to the first fixing unit, and a second fixing unit provided in the chamber case and spaced apart from the pattern electrode plate. A substrate on which an inked metallic nano-material is deposited is received on the second fixing unit. The device also includes a power supply unit for supplying power to the first fixing unit and the second fixing unit, and a drying unit for drying the inked metallic nano-material patterned on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.