Patent · US Active

Multilayer electronic component systems and methods of manufacture

US7834808B2 · kind B2 · utility

5Cited by

4References

19Claims

0Family size

Assignee

Georgia Tech Research Corporation · US

Inventors

Dane Thompson · Atlanta, US
Guoan Wang · South Burlington, US
Nickolas D. Kingsley · Atlanta, US
Ioannis Papapolymerou · Decatur, US
Emmanouil Tentzeris · Atlanta, US
Ramanan Bairavasubramanian · Hiawatha, US
Gerald DeJean · Redmond, US
RongLin Li · Norcross, US

Key dates

Filing date	Nov 23, 2005
Grant date	Nov 16, 2010
Priority date	—
Expiry date	Jan 28, 2027

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49016
WIPO fieldTelecommunications
WIPO sectorElectrical engineering

Abstract

Multilayer electronic component systems and methods of manufacture are provided. In this regard, an exemplary system comprises a first layer of liquid crystal polymer (LCP), first electronic components supported by the first layer, and a second layer of LCP. The first layer is attached to the second layer by thermal bonds. Additionally, at least a portion of the first electronic components are located between the first layer and the second layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.