Computer component protection
US7835147B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2008 |
| Grant date | Nov 16, 2010 |
| Priority date | — |
| Expiry date | May 13, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4935
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.