Patent · US Active

System for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules

US7835157B2 · kind B2 · utility

22Cited by

3References

19Claims

0Family size

Assignee

IMEC · BE

Inventors

Hendrikus Tilmans · Eijsden, NL
Eric Beyne · Heverlee, BE
Henri Jansen · Leuven, BE
Walter De Raedt · Edegem, BE

Key dates

Filing date	Dec 6, 2007
Grant date	Nov 16, 2010
Priority date	—
Expiry date	Jun 3, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01H59/0009
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

An interconnect module and a method of manufacturing the same. The method of making an interconnect module on a substrate comprises forming an interconnect section on the substrate. The interconnect section comprises at least two metal interconnect layers separated by a dielectric layer. The method further comprises forming a passive device on the substrate at a location laterally adjacent to the interconnect section. The passive device comprises at least one moveable element comprising a metal layer. The method further comprises forming the metal layer and one of the at least two metal interconnect layers from substantially the same material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.