Patent · US Active

Die for forging at high temperatures

US7836744B2 · kind B2 · utility

0Cited by

15References

25Claims

0Family size

Assignee

Leistritz Aktiengesellschaft · DE

Inventors

Werner Hufenbach · Dresden, DE
Albert Langkamp · Dresden, DE
Peter Janschek · Mülheim an der Ruhr, DE

Key dates

Filing date	Jul 25, 2007
Grant date	Nov 23, 2010
Priority date	—
Expiry date	Oct 16, 2027

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB21J13/02
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

Die for high temperature forging of metal components, in particular intermetal components, including and upper an a lower die, characterized in that provided to each die part, at room temperature and with some clearance, is a surrounding reinforcing ring against which each die part is positioned when heated due to its thermal expansion and via which a compressive stress is exerted onto each die part (4).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.