Method of manufacturing a substrate for a mini-UICC smart card with an associated plug-in UICC adapter, and a resulting substrate
US7837122B2 · kind B2 · utility
22Cited by
15References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 2, 2005 |
| Grant date | Nov 23, 2010 |
| Priority date | — |
| Expiry date | Dec 29, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of producing a smart card having a reduced format in relation to a second standard format and an adapter with the second format, which is associated with the smart card. A card body has a zone for the extraction of the smart card and a zone for the extraction of the adapter. At least the smart card is extracted from the support. The smart card is extracted from a zone located outside the peripheral outline of the adapter extraction zone. The invention also relates to the support thus obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.