Fluid deposition device
US7837310B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2006 |
| Grant date | Nov 23, 2010 |
| Priority date | — |
| Expiry date | Aug 21, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J29/02
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A fluid deposition device including a platen and a cartridge mount assembly is described. The platen is configured to support a substrate upon which a fluid will be deposited. The cartridge mount assembly includes a receptacle configured to receive a print cartridge and multiple electrical contacts configured to mate with corresponding electrical contacts on the print cartridge. In one implementation, the cartridge mount assembly further includes a vacuum connector configured to mate with a vacuum inlet included on the print cartridge. When the print cartridge is received in the receptacle, the print cartridge can form connections with the electrical contacts and with the vacuum connector of the receptacle at substantially the same time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.