Method of manufacturing diamond substrates
US7837793B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2004 |
| Grant date | Nov 23, 2010 |
| Priority date | — |
| Expiry date | Jul 27, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T117/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A tiled array of diamond plates, which is suitable for wafer scale processing, for example, in the manufacture of electronic or other device structures on the diamond plates. The diamond plates are fixed to a support layer, preferably a polycrystalline diamond support layer, in a substantially planar arrangement such that at least one of the major surfaces of the respective fixed diamond plates defines a fabrication surface that is exposed for further processing. The support layer may be a backing layer, in which case only one of the major faces of the diamond substrate is exposed for further processing, or may extend between respective diamond substrates such that both major surfaces are exposed for further processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.