Electroplating systems and methods
US7837850B2 · kind B2 · utility
1Cited by
7References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2005 |
| Grant date | Nov 23, 2010 |
| Priority date | — |
| Expiry date | Sep 23, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/2885
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplating system is provided. The system comprises a reaction tank, a tube, and a video bubble detector. The reaction tank, having a first diameter, contains a plating solution. The tube, connecting to the reaction tank, comprises an inflow tube and a branch, wherein the inflow tube inputs the plating solution into the reaction tank, and the branch has an enlarged part having the first diameter. The video bubble detector, mounted on the enlarged part of the branch, detects the presence of a bubble in the plating solution flowing through the branch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.