Patent · US Active

Corrugated polymeric void board

US7838095B2 · kind B2 · utility

3Cited by

19References

15Claims

0Family size

Assignee

ILLINOIS TOOL WORKS INC. · US

Inventors

Tilak Varma · Grayslake, US
Lawrence Share · Skokie, US
Lawrence R. Peck · Frankfort, US

Key dates

Filing date	Jun 17, 2005
Grant date	Nov 23, 2010
Priority date	—
Expiry date	Aug 2, 2027

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/24744
WIPO fieldHandling
WIPO sectorMechanical engineering

Abstract

A polymeric void-board is placed between adjacent horizontal layers of bricks to maintain an opening in a lower of the layers. The void-board is fabricated from a first relatively thin planar element having first and second surfaces having a plurality of parallel ribs extending from and generally transverse to the first surface and a second relatively thin planar element having first and second surfaces having a plurality of parallel ribs extending from and generally transverse to the first surface. The first and second elements are joined to one another with the ribs of the first element engaging and joined to the second element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.