Method of reducing temperature difference between a pair of substrates
US7838300B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2007 |
| Grant date | Nov 23, 2010 |
| Priority date | — |
| Expiry date | Mar 17, 2029 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2013/006
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method of reducing a temperature difference between a high-temperature and a low-temperature substrate includes interposing a heat transfer facilitating layer which has a higher thermal conductivity than air and can hold particles between the substrates, and maintaining close contact between the high-temperature substrate, the heat transfer facilitating layer, and the low-temperature substrate, wherein formation of an air layer can be at least substantially prevented between the high-temperature substrate and the heat transfer facilitating layer, and between the low-temperature substrate and the heat transfer facilitating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.