Optoelectronic component
US7838357B2 · kind B2 · utility
17Cited by
20References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2002 |
| Grant date | Nov 23, 2010 |
| Priority date | — |
| Expiry date | Jan 1, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48247
Abstract
Optoelectronic component, having a housing body (2), an optoelectronic semiconductor chip (3) arranged in a recess (6) of the housing body, and having electrical terminals (1A, 1B), the semiconductor chip being electrically conductively connected to the electrical terminals of the leadframe. The housing body (2) is formed from an encapsulation material, with a filler which has a high degree of reflection in a wavelength range from the UV range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.