Structures and methods for an application of a flexible bridge
US7838409B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 12, 2010 |
| Grant date | Nov 23, 2010 |
| Priority date | — |
| Expiry date | Jan 12, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10674
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
One embodiment of the present invention provides a system that facilitates high-bandwidth communication using a flexible bridge. This system includes a chip with an active face upon which active circuitry and signal pads reside, and a second component with a surface upon which active circuitry and/or signal pads reside. A flexible bridge provides high-bandwidth communication between the active face of the chip and the surface of the second component. This flexible bridge provides a flexible connection that allows the chip to be moved with six degrees of freedom relative to the second component without affecting communication between the chip and the second component. Hence, the flexible bridge allows the chip and the second component to communicate without requiring precise alignment between the chip and the second component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.