Patent · US Active

Spray dispensing method for applying liquid metal

US7838418B2 · kind B2 · utility

2Cited by

4References

23Claims

0Family size

Assignee

Apple Inc. · US

Inventors

Michael D. Hillman · Los Altos, US
Gregory L. Tice · Los Altos, US
Oscar Woo · Santa Cruz, US
Amir Salehi · San Jose, US
Richard Lidio Blanco, Jr. · Santa Clara, US
Ronald J. Smith · Menlo Park, US
Sean Bailey · San Francisco, US
Anwyl M. McDonald · Palo Alto, US
Clayton R. Anderson · Corona, US
James M. Crowder · Greenwich, US
Jeffrey J. Van Norden · Clifton Park, US
Jonathan Neal Urquhart · Saratoga Springs, US

Key dates

Filing date	Dec 11, 2007
Grant date	Nov 23, 2010
Priority date	—
Expiry date	Feb 24, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3011
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments of a method for applying a thermal-interface material are described. During this method, a first surface of a heat-removal device and a second surface of a semiconductor die are prepared. Next, a region on a given surface, which is at least one of the first surface and the second surface, is defined. Then, the thermal-interface material is applied to at least the region, where the thermal-interface material includes a material that is a liquid metal over a range of operating temperatures of the semiconductor die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.