Sealant material
US7838589B2 · kind B2 · utility
3Cited by
111References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2007 |
| Grant date | Nov 23, 2010 |
| Priority date | — |
| Expiry date | Jul 7, 2029 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K2200/0647
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
There is disclosed a sealant material for providing sealing to a substrate and preferably an interface. The sealant material may also include a material, shape, ingredient or otherwise for inhibiting the flow of bubbles throught the material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.