Hot melt adhesive based on styrene-ethylene-ethylene-propylene-styrene copolymer
US7838590B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 8, 2007 |
| Grant date | Nov 23, 2010 |
| Priority date | — |
| Expiry date | Nov 26, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31931
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A hot melt adhesive composition, comprising a blend of components including about 1% to about 20% by weight of a styrene-ethylene-ethylene-propylene-styrene (SEEPS) random block copolymer; about 10% to about 70% by weight of a first midblock tackifying resin having a softening point of at least about 85° C.; about 0 to 65% of a second midblock tackifying resin; about 5% to about 60% by weight of a plasticizer; about 0% to about 20% by weight of an end block reinforcing resin having a softening point equal to or higher than 115° C.; and about 0.1% to about 5% of a stabilizer; wherein the components total 100% by weight of the composition, and the viscosity of the composition is equal to or less than about 20,000 mPa.s at 160° C. Laminates, especially those used in disposable soft goods, and methods of making such laminates using the hot melt adhesive composition are also described. The adhesive composition and/or laminate may be used in making a variety of end products such as a disposable diaper, a sanitary napkin, a bed pad, a bandage, a surgical drape, a tape, a label, a plastic sheet, a nonwoven sheet, a paper sheet, a cardboard, a book, a filter, or a package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.