Micromodules including integrated thin film inductors
US7838964B2 · kind B2 · utility
23Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2009 |
| Grant date | Nov 23, 2010 |
| Priority date | — |
| Expiry date | Feb 25, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Micromodules and methods of making them are disclosed. An exemplary micromodule includes a substrate having a thin film inductor, and a bumped die mounted on the substrate and over the thin film inductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.