Electronic device, standoff member, and method of manufacturing electronic device
US7838987B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 19, 2005 |
| Grant date | Nov 23, 2010 |
| Priority date | — |
| Expiry date | May 19, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device comprises a semiconductor device having a package substrate with bumps. The semiconductor device is bonded to a mounting substrate by flip-chip bonding. A standoff member supports the package substrate on the mounting substrate with a predetermined standoff between the package substrate and the mounting substrate. The standoff member comprises a hole provided in the mounting substrate, an insertion portion provided to be contained in the hole, and a standoff portion provided to contact and support the package substrate such that the standoff portion has a height, equivalent to the predetermined standoff, on the mounting substrate and enables relative displacement of the package substrate to the mounting substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.