Filtered feedthrough assemblies for implantable devices and methods of manufacture
US7839620B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2007 |
| Grant date | Nov 23, 2010 |
| Priority date | — |
| Expiry date | Mar 7, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/435
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A solder joint between a capacitive element and a ferrule of a filtered feedthrough assembly for an implantable medical device is formed from a solder pre-form mounted on a portion of an external surface of the capacitive element, which portion of the external surface may be overlaid with a layer including a noble metal. Another solder joint may be formed between the capacitive member and each feedthrough pin; and, for an assembly including a plurality of feedthrough pins, each of the other solder joints may be formed from a solder pre-form mounted onto the external surface of the capacitive element by inserting each pin through a corresponding ring of a plurality of rings connected together to form the solder pre-form.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.