Methods for integration of thin-film capacitors into the build-up layers of a PWB
US7841075B2 · kind B2 · utility
4Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2007 |
| Grant date | Nov 30, 2010 |
| Priority date | — |
| Expiry date | Sep 7, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49128
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided herein are devices comprising a printed wiring board that comprise, singulated capacitors fabricated from known good, thin-film, fired-on-foil capacitors. Provided are methods of incorporating the singulated capacitors into the build-up layers of a printed wiring board to minimize impedance. The singulated capacitors have a pitch that allows each power and ground terminal of an IC to be directly connected to a power and ground electrode, respectively, of its own singulated capacitor. Using a feedstock of known good, fired-on-foil capacitors allows for improved PWB yield.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.