Edge-molding system for floor coverings
US7841151B2 · kind B2 · utility
3Cited by
41References
1Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 15, 2008 |
| Grant date | Nov 30, 2010 |
| Priority date | — |
| Expiry date | Dec 26, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/195
- WIPO fieldFurniture, games
- WIPO sectorOther fields
Abstract
An edge molding providing an edging for a floor covering such as a carpet, rug, tile and the like floor coverings comprising a stepped-molding which attaches to a subfloor edge through a hook and loop means to provide an edge molding for a floor covering which floor covering is attached to the subfloor through a means of a hook and loop arrangement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.