Electronic device and assembling method thereof
US7841870B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 27, 2009 |
| Grant date | Nov 30, 2010 |
| Priority date | — |
| Expiry date | Sep 27, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/1613
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An electronic device and an assembling method thereof are provided. The electronic device includes a first electronic module, a second electronic module, and a through connection element. The first electronic module includes a plurality of electronic units, a plurality of lead wires, a daughterboard, and a first connector. The first connector is disposed on the daughterboard. The lead wires are separately connected between the electronic units and the daughterboard. The daughterboard is electrically connected between the lead wires and the first connector. The second electronic module includes a motherboard and a second connector, wherein the second connector disposed on the motherboard is electrically connected with the motherboard. The through connection element being assembled between the first and the second connectors is electrically connected to the first and the second connectors to connect the first electronic module with the second electronic module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.