Ultrasonic energy for adhesive bonding
US7842146B2 · kind B2 · utility
3Cited by
34References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2007 |
| Grant date | Nov 30, 2010 |
| Priority date | — |
| Expiry date | Dec 6, 2028 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16B11/006
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An adhesive is contacted with a surface of a substrate and ultrasonic energy is applied to the adhesive to enhance the bonding of the adhesive to the surface of the substrate. The ultrasonic energy, particularly ultrasonic vibrations, can assist the adhesive in wetting the substrate surface, curing, polymerization or the like to enhance bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.