Extreme ultraviolet photolithography mask, with resonant barrier layer
US7842438B2 · kind B2 · utility
8Cited by
0References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 2, 2007 |
| Grant date | Nov 30, 2010 |
| Priority date | — |
| Expiry date | Sep 7, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F1/32
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention relates to extreme ultraviolet photolithography masks that operate in reflection. These masks comprise a lower mirror covering a substrate, and two types of reflecting zones Z1 and Z2 in order to form a phase shift mask. An etch stop layer is interposed between the lower mirror and an upper reflective structure. This layer has a thickness such that it behaves like a reflective resonant cavity surrounded by the upper and lower reflective structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.