Thermopile infrared sensor array

US7842922B2 · kind B2 · utility

Assignee

• Heimann Sensor GmbH · DE

Inventors

• Wilhelm Leneke · Taunusstein, DE
• Marion Simon · Schlangenbad, DE
• Mischa Schulze · Simbach, DE
• Karlheinz Storck · Lorch, DE
• Joerg Schieferdecker · Wiesbaden, DE

Key dates

• Filing date: May 16, 2006
• Grant date: Nov 30, 2010
• Expiry date: Oct 26, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3025
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

A thermopile infrared sensor array, comprises a sensor chip with a number of thermopile sensor elements, made from a semiconductor substrate and corresponding electronic components. The sensor chip is mounted on a support circuit board and enclosed by a cap in which a lens is arranged. The aim is the production of a monolithic infrared sensor array with a high thermal resolution capacity with a small chip size and which may be economically produced. The aim is achieved by arranging a thin membrane made from non-conducting material on the semiconductor substrate of the sensor chip on which the thermopile sensor elements are located in an array. Under each thermopile sensor element, the back side of the membrane is uncovered in a honeycomb pattern by etching and the electronic components are arranged in the boundary region of the sensor chip. An individual pre-amplifier with a subsequent low-pass filter may be provided for each column and each row of sensor elements.