Method of making a fiber reinforced printed circuit board panel and a fiber reinforced panel made according to the method
US7843057B2 · kind B2 · utility
2Cited by
2References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 17, 2005 |
| Grant date | Nov 30, 2010 |
| Priority date | — |
| Expiry date | May 17, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24994
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of making a printed circuit board panel, a printed circuit board panel made according to the method, and a system incorporating a printed circuit board provided onto the panel. The printed circuit board panel has a panel top edge, a panel bottom edge parallel to the panel top edge, and two parallel panel side edges, and further includes a first set of fiber bundles extending at the predetermined angle with respect to the panel side edges, and a second set of fiber bundles extending at the predetermined angle with respect to the panel top edge.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.