Underfill for light emitting device
US7843074B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2006 |
| Grant date | Nov 30, 2010 |
| Priority date | — |
| Expiry date | Jun 29, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/84
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light emitting chip is disposed on a support surface. A plurality of bonding bumps are disposed in a gap between the light emitting chip and the support surface. The plurality of bonding bumps provide at least one electrical power input path to the light emitting chip. An underfill comprising underfill material is disposed in the gap between the light emitting chip and the support surface such that the underfill substantially fills the gap but does not form a fillet extending outside the gap over sidewalls of the light emitting chip. The underfill is configured to provide at least one of (i) mechanical support for the light emitting chip and (ii) a thermal conduction path from the light emitting chip to the support surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.