Component shape profiling method and component mounting method
US7843573B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2006 |
| Grant date | Nov 30, 2010 |
| Priority date | — |
| Expiry date | Jul 28, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53261
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for profiling the shape of a component using a line sensor (110) which is provided in a component mounter (100) and which profiles the shape of the component (200) three-dimensionally by (a) projecting a sweeping light onto the component (200) in a relative movement between the line sensor (110) and the component (200) held by a mounting head (103) so that the sweeping light traverses the direction of the movement and (b) detecting the reflected light from the component using a detector (119). The method includes getting the component (200) from the component supply unit 101 using the mounting head (103), rotating the component (200) by a predetermined angle within a predetermined surface, and profiling the shape of the rotated component using the line sensor (110).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.