Patent · US Active

Method for assembling a carrier for integrated circuits

US7845068B2 · kind B2 · utility

0Cited by

2References

6Claims

0Family size

Assignee

Silverbrook Research Pty Ltd · AU

Inventors

Stephen Richard O'Farrell · Sydney, AU
Jan Waszczuk · Sydney, AU
David Bernardi · Chatswood, AU
Toby Desmond Oste · Chatswood, AU
Mark Janos · Sydney, AU
William Granger · Sydney, AU

Key dates

Filing date	Aug 19, 2008
Grant date	Dec 7, 2010
Priority date	—
Expiry date	Jun 5, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/5313
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

The invention relates to a method for assembling a carrier for integrated circuits. The carrier has upper and lower parts. The method includes the steps of positioning the lower part in a bottom clamp portion retained in a bottom clamp receptacle, positioning a top clamp portion in a top clamp receptacle, the clamp portions being configured to engage each other in a locking manner, and positioning the upper part in a first gripper. The method also features the steps of applying adhesive to at least one of the parts, pressing said upper part onto the bottom part retained by the bottom clamp receptacle with the first gripper, whilst retrieving the top clamp portion with a second gripper, and locking the top clamp portion to the bottom clamp portion with the second gripper to clamp the parts together.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.