Monitoring deformation and time to logically constrain a bonding process
US7845542B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2005 |
| Grant date | Dec 7, 2010 |
| Priority date | — |
| Expiry date | Dec 2, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process control procedure for a bonding process includes predetermining a deformation limit and a deforming time limit is for deforming a bonding precursor member. The bonding precursor member is deformed while monitoring instantaneous deformation values and instantaneous deforming time values for the bonding precursor member. A deforming shut-down time value is set at an instantaneous deforming time value corresponding to an occurrence of a first condition or a second condition. The first condition is an instantaneous deformation value for the bonding precursor member reaching the deformation limit and the second condition is an instantaneous deforming time value for the bonding precursor member reaching the deforming time limit. Deformation of the bonding precursor member is shut down at the deforming shut-down time value, thereby producing a deformed bond member from the bonding precursor member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.