Patent · US Active

Printhead integrated circuit attachment film having differentiated adhesive layers

US7845755B2 · kind B2 · utility

3Cited by

1References

9Claims

0Family size

Assignee

Silverbrook Research Pty Ltd · AU

Inventors

Sarkis Keshishian · Sydney, AU
Susan Williams · Sydney, AU
Paul A. Papworth · Wappingers Falls, US
Kia Silverbrook · Sydney, AU

Key dates

Filing date	Mar 17, 2008
Grant date	Dec 7, 2010
Priority date	—
Expiry date	Jun 11, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/24322
WIPO fieldTextile and paper machines
WIPO sectorMechanical engineering

Abstract

A laminated film for attachment of printhead integrated circuits to an ink supply manifold. The film has a plurality of ink supply holes defined therein and film comprises: a central polymeric film; a first adhesive layer for bonding a first surface of the film to the ink supply manifold; and a second adhesive layer for bonding a second surface of the film to the printhead integrated circuits. The central polymeric film is sandwiched between the first and second adhesive layers. A first melt temperature of the first adhesive layer is at least 20° C. less than a second melt temperature of the second adhesive layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.